论文部分内容阅读
Study on the Gold-Gold Thermocompression Bonding for Wafer-level Packaging
【机 构】
：
Nanjing Electronic Devices Institute,Nanjing 210016,China
【出 处】
：
中国微米纳米技术学会第十届学术年会暨第一届国际会议(1st International Conference of th
【发表日期】
：
2008年12期
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