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  5. Fabrication of Capacitive Micromachined Ultrasonic Transducers with Through-Glass-Via Interconnects

Fabrication of Capacitive Micromachined Ultrasonic Transducers with Through-Glass-Via Interconnects

来源 :2015两岸超声技术与医学研讨会 | 被引量 : 0次 | 上传用户：WSZYC
【作 者】
：
Omer Oralkan Xiao Zhang F.Yalcin Yamaner 
【机 构】
：
Department of Electrical and Computer Engineering,NCSU,Raleigh,North Carolina,USA
【出 处】
：
2015两岸超声技术与医学研讨会
【发表日期】
：
2015年期
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