【摘 要】
：
In cutting of brittle materials,experimentally it was observed that there is an upper bond of tool cutting edge radius,beyond which,although the undeformed chip thickness is small than the tool cuttin
【机 构】
：
Department of Mechanical Engineering,National University of Singapore
【出 处】
：
INternational Conference on Product Design and Manufacturing
论文部分内容阅读
In cutting of brittle materials,experimentally it was observed that there is an upper bond of tool cutting edge radius,beyond which,although the undeformed chip thickness is small than the tool cutting edge radius,the ductile mode cutting cannot be achieved.However,why there is an upper bond of tool cutting edge radius in nanoscale ductile mode cutting of brittle materials has not been fully understood.In this study,based on the tensile stress distribution and the characteristics of the distribution obtained from molecular dynamics (MD) simulation of nanoscale ductile cutting of silicon,an approximation for the tensile stress distribution was obtained.Using this tensile stress distribution with the principles of geometrical similarity and fracture mechanics,the critical conditions for the crack initiation has been determined.The result showed that there is a critical tool cutting edge radius,beyond which crack initiation can occur in the nanoscale cutting of silicon and the chip formation mode is transferred from ductile to brittle.That is,this critical tool cutting edge radius is the upper bond of the tool cutting edge radius for ductile mode cutting of silicon.
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