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以成熟泡桐为基体,NaH2PO2为还原剂,以Ni(Ac)2作催化剂,通过低温水热法在木材基质内下将Cu(Ac)2原位还原得到金属Cu木材复合材料。使用光学显微镜、X-射线衍射仪(XRD)和SEM对复合材料的结构形貌进行表征,使用万能力学实验机和万用电表测试复合材料的力学性能和导电性能。研究结果表明:复合材料在2θ=43.22°和50.36°出现了铜的特征峰;金属铜均匀分布在木材细胞壁内且粒径细小,与木材细胞壁结合紧密。改性木材的轴向抗压强度和比例极限均显著增强,较素材最大增加了48.6%和72.7%。改性木材的导电性能良好,其轴向电导率值最大可达到27.78×10-6 S·m-1。
Using mature Paulownia as substrate, NaH2PO2 as reductant and Cu (Ac) 2 as catalyst, Cu (Ac) 2 was reduced by in-situ reduction of Cu (Ac) 2 in the wood substrate by low temperature hydrothermal method. The morphology of the composites was characterized by optical microscopy, X-ray diffraction (XRD) and scanning electron microscopy (SEM). The mechanical properties and electrical conductivity of the composites were tested by universal mechanical testing machine and multimeter. The results show that the characteristic peaks of copper appear at 2θ = 43.22 ° and 50.36 °. The copper is uniformly distributed in the cell wall of wood and has a small particle size and is tightly combined with the cell wall of wood. The axial compressive strength and the proportionality limit of modified wood significantly increased, which increased by 48.6% and 72.7% compared with the maximum. The electrical conductivity of modified wood is good, and its axial conductivity can reach 27.78 × 10-6 S · m-1.