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5. 2D and 3D Photonic Integrated Microsystems for Future Communication,Computing,and Imaging Applicatio

2D and 3D Photonic Integrated Microsystems for Future Communication,Computing,and Imaging Applicatio

来源 :The 9th International Workshop on Innovation and Commerciali | 被引量 : 0次 | 上传用户：wolantu

【作 者】

：

S.J.Ben Yoo 

【机 构】

：

DepartmentofElectricalandComputerEngineering,UniversityofCalifornia,Davis

【出 处】

：

The 9th International Workshop on Innovation and Commerciali

【发表日期】

：

2015年8期

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