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5. Sonic-Shearography for Nondestructive Inspection of Bonding Integrity Between Tiles and Building Wal

Sonic-Shearography for Nondestructive Inspection of Bonding Integrity Between Tiles and Building Wal

来源 :国际计算/实验科学与工程学术会议(icces2011) | 被引量 : 0次 | 上传用户：fbhww

【作 者】

：

Michael Y. Y. Hung 

【出 处】

：

国际计算/实验科学与工程学术会议(icces2011)

【发表日期】

：

2011年9期

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