Effect of surface treatment using N2 DF-CCP plasma on electrical properties and chemical structures

来源 :中国物理学会2013年秋季学术会议 | 被引量 : 0次 | 上传用户:ineedtoxiazai
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  With the aggressive scaling down of microelectronic devices to the nanometer regime,the conventional SiO2 thickness had been reduced to sub-nanometer,the leakage current caused by the direct tunneling mechanism between the gate electrode and Si channel region has significantly increased,thereby worsening the performance of complementary metal oxide semiconductor filed-effect transistors (MOSFETs).
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