The interconnection between two different substrates by the two typical bonding techniques-diffusion bounding and soldering-is essentially related to the growth behaviors of intermetallic compound (IMC) layers at the interfaces of these two substrates.While the applications of high magnetic field to the material processing have been developed rapidly,it is hoped to find some new properties of materials or special phenomena in this area.So it is interesting to investigate the growth behaviors of IMC layers and the effect of high magnetic field.In our previous work [1],the effects of high magnetic field on the growth of Sn-3Ag-0.5Cu/Cu IMC layers in the solid aging have been reported.