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为适应超大规模集成电路器件的发展，微电路图形的特征线宽愈来愈细的特点，发展了电子束光刻及Ｘ射线光刻，而Ｘ射线光刻由于其极高的分辨率，对未来的大规模集成电路器件的制作具有很大的应用潜力。随之而来的是要有高精度的定位工作台，以保证高套刻精度的要求。
In order to adapt to the development of VLSI devices, the feature lines of microcircuit patterns are getting smaller and smaller. Electron beam lithography and X-ray lithography have been developed. Because of its extremely high resolution, X-ray lithography The future of large-scale integrated circuit device production has great potential applications. Followed by the need to have high-precision positioning table, in order to ensure high precision engraving requirements.