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通过多靶共溅射的方法,制备了(AlCrTaTiNi)N和双层AlCrTaTiNi/(A1CrTaTiNi)N扩散阻挡层,并利用XRD,EDS和SEM研究了其组织结构、相组成及在高温下的热稳定性能.结果表明Cu/(A1CrTaTiNi)N/Si经500℃退火后界面处已有脱开倾向,700℃后Cu膜则完全脱落.AlCrTaTiNi可增强Cu和(A1CrTaTiNi)N的粘附性.AlCrTaTiNi/(AlCrTaTiNi)N经800℃退火后仍能起到有效的扩散阻挡性能,900℃下出现了深能级的Cu-Si相,方块电阻急剧升高,表明该阻挡层失效.
(AlCrTaTiNi) N and two layers of AlCrTaTiNi / (AlCrTaTiNi) N diffusion barrier were prepared by multi-target co-sputtering. The structure, phase composition and thermal stability at high temperature were studied by XRD, EDS and SEM Properties of Cu / (AlCrTaTiNi) N / Si annealed at 500 ℃ have been observed.The results show that the Cu film is completely detached at 700 ℃ .The adhesion of Cu and (AlCrTaTiNi) N can be enhanced by the addition of AlCrTaTiNi / (AlCrTaTiNi) N annealed at 800 ℃ can still play an effective diffusion barrier, a deep Cu-Si phase appears at 900 ℃, and the sheet resistance rises sharply, indicating that the barrier layer fails.