提出一种新型的非贵金属活化法辅助二次化学镀的氧化铝陶瓷基板化学镀铜工艺,成功制备了表面完整、分布均匀的铜镀层,进一步通过冷场发射扫描电镜(FE-SEM)做了具体分析。可以发现,经预处理活化之后的氧化铝基板表面产生一定程度的表面缺陷,主要包括不同梯度的台阶,颗粒与颗粒之间的边缘化以及‘地道式’的孔洞。在第一次化学镀铜沉积一定量的铜颗粒之后表面仍存在大量的空隙,即未镀区域。但在二次化学镀工艺之后,表面完全覆盖镀层,其中镀层表面上小的圆球状(2~3μm)铜颗粒夹杂在大的胞状(4~5μm)颗粒之间,整体上为颗粒与颗粒的物理聚集然后通过堆垛而形成的。 A new type of electroless copper plating process on alumina ceramic substrate which aided by non-precious metal activation method to assist the second electroless plating was proposed. The copper coating with complete surface and uniform distribution was successfully prepared and further confirmed by cold field emission scanning electron microscope (FE-SEM) analysis. It can be found that the surface of the alumina substrate after pretreatment activation produces some degree of surface defects, mainly including steps of different gradients, edge-to-edge between particles and particles, and ’tunnel’ holes. After the first electroless copper deposition of a certain amount of copper particles on the surface there are still a large number of voids, that is, uncoated region. However, after the secondary electroless plating process, the surface is completely covered with the coating, in which small spherical (2-3 μm) copper particles on the surface of the coating are sandwiched between large cell (4~5 μm) particles, and the particles are as a whole Physical aggregation is then formed by stacking.