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多芯片组件是一种先进的封装工艺，与传统的封装工艺相比，它具有更高的封装密度和更优异的性能。目前商用ＭＣＭ的基础条件薄弱和成本的昂贵共同限制了ＭＣＭ技术在产业市场之外的推广应用。目前现有的封装工艺还不具备ＭＣＭ工艺在体积、重量和可靠性方面的优势。由于ＭＣＭ工艺的工艺改进和计算机市场对高性能机需求的增长，ＭＣＭ正在向低档和中档计算机应用发展。本文介绍了ＭＣＭ的分类、设计要点、互连技术、工艺发展趋势、市场变化和这些封装系统的应用。
Multi-chip package is an advanced packaging process, compared with the traditional packaging process, it has a higher packaging density and superior performance. At present, the basic condition of commercial MCM is weak and the cost is too high, which limits the popularization and application of MCM technology beyond the industrial market. At present, the existing packaging process does not yet possess the advantages of volume, weight and reliability of the MCM process. Due to the process improvements in the MCM process and the growing demand for high-performance machines in the computer market, MCM is evolving to low-end and mid-range computer applications. This article describes the MCM classification, design points, interconnect technology, process development trends, market changes and the application of these packaging systems.