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美国哥伦比亚大学的研究者们已经证明,用一种光学技术可以提高大规模集成电路的跨接能力。研究人员借助激光刻蚀方法,在那些可以联接单模光纤芯线的硅电路片上先钻一个孔,然后在孔的基部做上一个单 p—n 结光二极管接收器。当嵌入光纤后,通过光纤传导来的光信号,即可在电路中产生一个电信号。
Researchers at Columbia University have demonstrated that using an optical technology can improve the crossover capability of large scale integrated circuits. Using laser etching, researchers drilled a hole in a silicon chip that could be connected to a single-mode fiber core and then made a single p-n junction diode receiver at the base of the hole. When embedding the optical fiber, optical signals transmitted through the optical fiber, you can generate an electrical signal in the circuit.