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为了满足现代高性能雷达天线罩结构粘接的要求,采用环氧树脂和热塑性树脂改性氰酸酯树脂的方法研制了改性氰酸酯胶膜。利用FTIR谱图法测定固化反应过程中—OCN基的转化率。胶膜有良好工艺黏性,室温贮存期为20 d。胶膜在200℃下的剪切强度>10 MPa。测试频率为9.375 GHz时,胶膜的介电常数为3.09,介电损耗为0.014。
In order to meet the requirements of structural bonding of modern high-performance radomes, a modified cyanate ester adhesive film was developed by using epoxy resin and thermoplastic resin modified cyanate resin. The conversion of -OCN groups during the curing reaction was measured by FTIR spectroscopy. Film has good process viscosity, room temperature storage period of 20 d. Shear strength of the film at 200 ° C> 10 MPa. When the test frequency is 9.375 GHz, the dielectric constant of the film is 3.09 and the dielectric loss is 0.014.