集成电路发展到大规模集成电路,要求精密图形以及多层的芯片内引线。为此,对布线材料的选择及制造工艺进行了多种研究。但尚未得到完美的解答,目前仍是以蒸发铝制引线为主。本文将列举有关布线技术的若干问题,以铝布线为中心阐述一下。 The development of integrated circuits to large scale integrated circuits requires precision graphics and multi-layer on-chip leads. To this end, a variety of research on the choice of wiring materials and manufacturing processes. But have not yet been the perfect answer, is still based on lead evaporation aluminum. This article will list a number of issues related to wiring technology to aluminum wiring as the center to elaborate.