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发明的要点在室温化学镀镍的方法中,最初镀槽中含有:(a)镍盐,(b)次磷酸钠,(c)焦磷酸钠,(d)氢氧化胺。根据所需要的电镀速度来选择氢氧化胺的浓度,以便调节镀槽中的pH达到初始值(在9.0～11.5之间)。加进强碱(例如氢氧化钠)以增加槽中的pH值,以便基本上保持电镀速度不变。在使用中,镀槽的pH降低,只要氢氧化胺不使pH降到初始值以下,则电镀速度保持相对不变。pH的初始值是以氢氧化胺调整的。当更换槽液时,附加入的羟基离子的量就不需要精确控制,而且槽中pH控制允许有较宽的容限。
In the method of electroless nickel plating at room temperature, the first plating tank contains (a) a nickel salt, (b) sodium hypophosphite, (c) sodium pyrophosphate, and (d) an amine hydroxide. The concentration of amine hydroxide is chosen according to the plating speed required in order to adjust the pH in the bath to the initial value (between 9.0 and 11.5). A strong base (eg, sodium hydroxide) is added to increase the pH in the tank so that the plating rate is substantially maintained. In use, the pH of the plating tank is lowered and the plating rate remains relatively constant as long as the amine hydroxide does not lower the pH below the initial value. The initial pH value is adjusted with amine hydroxide. When changing the bath, the amount of added hydroxyl ions does not need to be precisely controlled, and the pH control in the bath allows for a wider tolerance.