To handle the thermal budget in SiGe BiCMOS process, a nonselective graphic epitaxial technology using molecular beam epitaxial (MBE) has been developed. SEM, AFM, XRD, and dislocation density measurements are carried out. The SiGe films RMS roughness is 0.45nm, and dislocation density is 0.3×103cm2～1.2×103cm2. No dislocation accumulation exists on the boundary of the windows; this indicates the high quality of the SiGe film. The experiment results show that the technology presented in this paper meets the fabrication requirements of SiGe BiCMOS.