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在BiSbCu钎料中添加Sn,分析Sn对BiSbCu钎料合金钎焊工艺性能的主要指标——钎料熔点和铺展面积的影响。结果表明:在Bi5Sb2Cu钎料合金中加入Sn可以显著降低钎料的熔点和显著增强钎料合金的铺展性能。当Sn的质量分数为10%时,Bi5Sb2Cu钎料的铺展面积为26.22 mm2,钎焊工艺性能最好。
Add Sn to BiSbCu solder, and analyze the main indexes of Sn brazing performance of BiSbCu solder alloy - the influence of solder melting point and spreading area. The results show that adding Sn into Bi5Sb2Cu solder alloy can significantly reduce the melting point of the solder and significantly improve the spreading performance of the solder alloy. When the mass fraction of Sn is 10%, the spreading area of Bi5Sb2Cu solder is 26.22 mm2, and the brazing process has the best performance.