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出于对健康和环境的考虑,限制铅、镉和含有其它有毒物质在混合集成电路产品应用的需求越来越大。根据2006年7月1日生效的欧盟禁令(即RoHS)这些物质是禁用的,电路生产商急于找到可以替换现有含铅和镉的产品。镉氧化物在厚膜金浆料中可以起到很好的粘附作用。金厚膜浆料主要用于要求高机械强度的领域,比如医疗器械,军事应用和高频电路。现在的挑战是开发一新的和传统的含镉浆料具有相同性能的无镉导体金浆料。在过去的10年中,贺利氏超前地研发了无铅无镉厚膜产品。到目前,贺利氏已经开发并且打入一些环保型厚膜产品市场。讨论一种新开发的厚膜导体金浆料,给出了在96%氧化铝基板和绝缘体基板上分别焊接金线和铝线的线键合数据。数据显示无铅无镉金导体和RoHS规定的可锡焊导体之间的匹配性,结果表明它可以应用于混合金属电路。
Due to health and environmental considerations, there is an increasing need to limit the use of lead, cadmium and other toxic substances in hybrid IC products. These substances are banned under the EU ban (ie RoHS), which came into force on July 1, 2006, and circuit manufacturers are eager to find products that can replace existing lead and cadmium. Cadmium oxide in thick film gold slurry can play a very good adhesion. Gold thick film slurry is mainly used for demanding areas of high mechanical strength, such as medical equipment, military applications and high-frequency circuits. The challenge now is to develop a new cadmium-free conductor gold paste that has the same properties as conventional cadmium-containing paste. For the past 10 years, Heraeus has been leading the development of lead-free cadmium-free thick film products. To date, Heraeus has developed and rolled out some eco-friendly thick film products. A newly developed thick film conductor gold paste is discussed. The wire bonding data of gold wire and aluminum wire are respectively welded on 96% alumina substrate and insulator substrate. The data show the match between lead-free, cadmium-free gold conductors and RoHS-compliant solderable conductors. The results show that it can be used in mixed-metal circuits.