论文部分内容阅读
现代化的微波电路技术正朝着高密度集成和小尺寸方面发展。因此在低成本高可靠方面就更加突出、更加复杂。目前实现低成本,高可靠的主要目标正向单片微波集成电路(MMIC)和小型化方面努力。单片集成电路的优点是便于批量生产、小尺寸和轻重量,而且还具有分别焊接有源器件的混合电路的灵活性,最近我们已研制成功了一种新型 BeO 混合技术——小型化 BeO 电路(MBC)。小型化电路元件的制造和组装工艺具有很高的生产重复性,而且从 UHF 到 K 波段的频率范围均能实现低成本生产。虽然 MBC 技术比厚膜电路技术要复杂些,但它有很高集成度和较少的附加结构。最近我们用该技术研制成功了 Ku 波段发射-接收雷达微型机。
Modern microwave circuit technology is moving towards high-density integration and small size. Therefore, it is more prominent and more complex in terms of low cost and high reliability. At present, the main objective of realizing low cost and high reliability is toward the monolithic microwave integrated circuit (MMIC) and miniaturization. The advantages of monolithic integrated circuits are their ease of mass production, small size and light weight, as well as the flexibility of a hybrid circuit that solders active devices separately. Recently, we have successfully developed a new BeO hybridization technology - the miniaturized BeO circuit (MBC). The miniaturization of circuit components manufacturing and assembly process with high reproducibility, and from UHF to K-band frequency range can achieve low-cost production. Although MBC technology is more complex than thick film circuit technology, it has a high degree of integration and fewer additional structures. Recently, we have successfully developed Ku-band transmit-receive radar microcomputers using this technology.