论文部分内容阅读
报道了一种采用电镀方法制作活动微结构的牺牲层工艺 ,该牺牲层技术可用于微电子机械装置中活动部件的制作。利用电镀形成Zn牺牲层 ,结合微细加工技术中的LIGA工艺对该工艺进行了验证 ,制作出可活动的微齿轮结构 ,齿轮直径为2 5 0 μm。
A sacrificial layer process for fabricating active microstructures by electroplating is reported. The sacrificial layer technology can be used for the fabrication of moving parts in microelectromechanical systems. Zn sacrificial layer was formed by electroplating, and the process was verified by LIGA technology in microfabrication technology to produce a movable micro-gear structure with a diameter of 250 μm.