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为了研究焊膏厚度对氮气保护再流焊CBGA组装板可靠性的影响 ,设计采用 0 .10mm、0 .15mm、0 .2 0mm三种厚度的焊膏和压缩空气与氮气保护再流焊来准备CBGA组装板可靠性试样。通过对组装板试样进行剪切强度、弯曲疲劳、热冲击和振动疲劳等可靠性试验来优化组装工艺过程。试验结果显示出 0 .15mm厚度的焊膏具有最佳的机械性能 ,氮气保护对改进组装板的性能起明显的作用。理论模型也定量给出了焊膏厚度与焊点性能之间的关系。
In order to study the influence of the solder paste thickness on the reliability of the nitrogen-protected reflow CBGA assembly board, the solder paste and compressed air of 0 .10mm, 0 .15mm and 0.220mm thickness are designed to be protected by reflow with nitrogen protection CBGA assembly board reliability samples. The assembling process is optimized by the reliability tests such as shear strength, bending fatigue, thermal shock and vibration fatigue on the assembled plate samples. The test results show that 0.15 mm thick solder paste has the best mechanical properties and nitrogen protection plays a significant role in improving the performance of the assembled board. The theoretical model also quantitatively gives the relationship between solder paste thickness and solder joint performance.