【摘 要】
：
The effects of aging time and temperature on the formation and growth behavior of interfacial intermetallic compound (IMC) of Sn-16Sb/Cu(wt％) solder joints prepared by using dip soldering were investigated. The results show that the major IMCs between Sn-
【机 构】
：
Key Lab for Robot and Welding Automation of Jiangxi Province, Nanchang University, Nanchang 330031,
【出 处】
：
武汉理工大学学报（材料科学版）（英文版）
论文部分内容阅读
The effects of aging time and temperature on the formation and growth behavior of interfacial intermetallic compound (IMC) of Sn-16Sb/Cu(wt％) solder joints prepared by using dip soldering were investigated. The results show that the major IMCs between Sn-16Sb solder and Cu substrate after thermal aging are Cu3Sn and Cu6Sn5. The thickness of the interfacial IMC in Sn-16Sb/Cu is linearly against the square root of aging time, which indicates that the growth of IMC is mainly controlled by diffusion between Cu and Sn atoms. By using linear regression method, the growth rate constants of interfacial IMC layers are 1.254×10-18, 8.821×10-18 and 1.22×10-17 m2s-1 for Sn-16Sb/Cu joints aged at 120, 150 and 170 ℃, respectively. Besides, the activation energy of the interfacial IMC growth was also calculated to be 68.27 kJ/mol. The IMC grain diameters after aging treatment increase with the increasing aging time, with i e, d = 0.492t0.106, d = 0.543t0.143 and d = 0.290t0.263 for aging temperatures of 120, 150 and 170 ℃, respectively. Besides, by using nanoindentation, the softening of Sn-16Sb solder was found during aging treatment. Moreover, the U-shape evolution of the values in hardness and Young\'s moduli was found in this work.
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