带有金属化孔的印制电路板,随着电子工业的飞速发展用量越来越大。为了满足电子设备高密度组装,高传输速度的需要,不但研制出高密度的多层印制板而且又出现了结构更为新颖的多层布线板。虽然它们的结构形式有所不同,但层间信号线的互联都采用了金属化孔技术。金属化孔镀层质量已成为互联是否可靠的关键。本文将以多层印制板孔金属化工艺为例对化学镀铜的各个工艺环节进行讨论。 With metalized hole printed circuit board, with the rapid development of the electronics industry, the increasing use of. In order to meet the high-density assembly of electronic equipment, high transmission speed needs, not only to develop high-density multi-layer PCB and the emergence of a more novel structure of the multilayer wiring board. Although the structure of their different forms, but the interlayer signal lines are used to interconnect the metal hole technology. The quality of metallized hole plating has become the key to the reliability of interconnects. This article will be multi-layer PCB hole metallization process as an example of various aspects of electroless copper plating process are discussed.