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（本刊讯）北京有色金属研究总院向社会推出陶瓷连接活性钎料及连接技术。该院可批量制备Ag-Cu-Ti、Cu-Ni-Ti、Cu-Ti、Ni-Ti等系列的合金型活性钎料，这些钎料可用于电真空氧化物陶瓷与金属的封接，也可用于近些年发展起来的精密陶瓷，如SiC、PSC、PSZ、AIN等与金属的连接。几
(Ben Kanxun) Beijing Nonferrous Metal Research Institute to launch ceramic bonding active solder and connection technology. The hospital can batch preparation of Ag-Cu-Ti, Cu-Ni-Ti, Cu-Ti, Ni-Ti and other series of alloy-type active brazing filler metal, these brazing filler metal can be used for electric vacuum oxide ceramics and also Can be used in precision ceramics developed in recent years, such as SiC, PSC, PSZ, AIN and other metal connections. a few