一、干法刻蚀简介刻蚀是形成图形的必不可少的技术。长期以来,在半导体器件加工工艺中一直延用在化学药品溶液中进行腐蚀的湿法腐蚀,用于湿法腐蚀具有工艺再现性差,劳动强度大,以及不易形成自动化生产的弱点,因而近年来逐步被干法刻蚀所取代。干法刻蚀就是利用反应气体,离子或反应活性原子团进行的刻蚀,与湿 First, the introduction of dry etching Etching is an essential form of graphics technology. For a long time, the wet etching of chemicals in chemical solutions has been used for a long time in the processing of semiconductor devices. The wet etching has the disadvantages of poor process reproducibility, high labor intensity and difficulty in forming automatic production. Therefore, in recent years, Was replaced by dry etching. Dry etching is the use of reactive gases, ions or reactive radicals etching, and wet