【摘 要】
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A new aluminum thin film percolation system, deposited on glass and silicon wafer surfaces by avapor deposition method, was investigated. By using the expansive
【机 构】
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Department of Physics
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A new aluminum thin film percolation system, deposited on glass and silicon wafer surfaces by avapor deposition method, was investigated. By using the expansive and mobile behaviors of the silicone oil,the Al films are quenched gradually by the silicone oil during the deposition process, Tne R-I behavior of thefilm system was studied, and the anomalous conductivity indicated that, at very low current, the hopping andtunneling effects in the films are much stronger than those of the normal film systems.
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