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针对传统注塑模具设计方法存在设计周期长、成本高且质量难以保证的不足,利用MoldFlow软件的MPI(Moldflow Plastic Insight)模块对手机外壳成型过程进行分析,通过对模具注射过程材料流动情况的仿真分析,预测出产品在注塑过程中可能出现的熔接痕缺陷,通过分析缺陷产生的原因和影响因素,对模具浇注系统进行改进与优化,从而消除了产品缺陷,提高了产品质量。
Aiming at the shortcomings of traditional injection mold design methods, such as long design cycle, high cost and difficult to guarantee quality, Moldflow Plastic Insight (MPI) module of MoldFlow software is used to analyze the molding process of mobile phone case. Through the simulation analysis of the material flow in the mold injection process , Predicts the weld defects that may appear in the process of injection molding. By analyzing the causes and influencing factors of defects, the mold casting system is improved and optimized, so as to eliminate product defects and improve product quality.