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Cubic Mgo.55Zno.45O thin film alloys have been deposited on Si substrates at low growth temperature. The topography of the cross section of the epitaxial film by scanning electronic microscope demonstrates good mor phology and high interfacial quality. The high (001) orientation and wide band-gap (Eg > 5.5 eV) of the cubic Mgo.55Zno.45 O thin films accord with the guidelines for metal-insulator-silicon (MIS) device applications. Using the cubic teary thin films as insulators, MIS structures have been fabricated. The capacitance-voltage measurements show the flat band voltage shift VFB of11.8 V and mobile ion density Dmc of 5.57 × 1010 cm-2 for the MIS structure. Leakage current density as low as ~ 10-7 A/cm2 is obtained at E = 700 kV/cm by the currentvoltage measurements. These unique structural and electrical properties of the fabricated MIS devices indicate that cubic MgZnO materials could become a new candidate for high-κ dielectrics used in silicon integrated circuit technologies.