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采用金相显微镜、SEM及EDS等分析手段对Cu/Al冷轧复合界面结合机理进行研究,建立扩散退火阶段不同轧制压下率时的扩散层生长动力学方程,并探讨了不同压下率对界面扩散层生长的影响。结果表明,轧制复合阶段界面形成激活中心数量随压下率的升高而增加,当压下率为75%时达到峰值。另外,压下率在退火温度较高时对扩散层生长影响显著。
The bonding mechanism of the Cu / Al cold-rolled composite interface was studied by means of metallographic microscope, SEM and EDS, and the diffusion equation of diffusion layer during diffusion-annealing was established. The effects of different reduction rates Effect on Interface Diffusion Layer Growth. The results show that the number of activation centers at the interface of the rolling compound phase increases with the reduction rate, reaching the peak value when the reduction rate is 75%. In addition, the reduction rate significantly affects the growth of the diffusion layer when the annealing temperature is high.