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利用高温云纹实验方法测试球栅阵列 (BGA)封装焊点的热应变 ,采用硅橡胶试件光栅复制技术 ,使测试环境温度提高到 2 0 0℃ .通过实时热应变测量 ,得到各焊点的热应变关系以及封装材料、电路板各部分的热应变分布状况 ,为研究集成电路封装组件焊点的建模和热疲劳破坏机理提供了可靠的实验依据
The thermal strain of BGA package solder joints was tested by high temperature moiré test method, and the temperature of the test environment was increased to 200 ° C by using the silicon rubber specimen raster duplication technology. Through the real-time thermal strain measurement, And the thermal strain distribution of the packaging materials and the various parts of the circuit board provide a reliable experimental basis for studying the modeling of the solder joints and the thermal fatigue failure mechanism of the IC package components