论文部分内容阅读
在半导体生产商不断推进器件和圆片厚度薄型化的形势下,为满足与新产品和加工工艺有关的生产工艺挑战,必须采用更新的分裂方法。新面世的产品射频识别标签,更完善的IC卡以及集成度更高的存储器件,随着更新的从逻辑到存储器及图像传感器各种产品先进封装技术的来临,需要越来越薄基片。对此提出了一种基于临时键合以及新颖的粘接剂技术的适合于薄圆片传送和处理加工的完全解决方案(设备,材料以及工艺过程)。这种方法与25μm以下厚度圆片以及在原有设备没有变更的现有生产线进行薄圆片产品发展路线图加工工艺相适应。
As semiconductor manufacturers continue to push thinner device and wafer thicknesses, newer splitting methods must be used to meet manufacturing process challenges associated with new products and processes. Newly-released product RFID tags, better IC cards and more integrated memory devices require thinner and thinner substrates as newer packaging technologies, ranging from logic to memory and image sensors, come to market. In this regard, a complete solution (equipment, material and process) suitable for thin wafer transfer and processing based on temporary bonding and novel adhesive technology is proposed. This method is compatible with thin wafer product development roadmap processing for wafers up to 25 μm thick and existing lines that have not been changed in the original equipment.