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半加成法中化学镀铜介质表面低粗化度处理安美特日本公司介绍高密度PCB制作中采用半加成法(SAP)时,以一种“Initiator”化学液处理绝缘介质表面,得到的表面粗糙度低而与化学镀铜层结合力高。用Initiator化学液的表面处理过程:向基板喷淋Initiator化学液,浸透绝缘层树脂,促使后续使绝缘层均匀蚀刻;烘干基板,去除板面化学液的溶剂成分,并促进化学液与绝缘层的反应;经过高锰酸盐溶液,氧化反应去
Semi-additive chemical copper plating medium surface low degree of coarseness treatment Atotech Japan Company Introduction Semi-additive method (SAP) in the production of high-density PCB, with an “Initiator ” chemical treatment of insulating medium surface, The obtained surface roughness is low and the bonding strength with the electroless copper plating layer is high. Surface treatment with Initiator chemical: Spraying the Initiator chemical to the substrate, impregnating the insulation resin, and subsequently etching the insulation evenly; drying the substrate to remove the solvent components of the chemical on the plate surface and promoting the chemical and insulating layers The reaction; After permanganate solution, the oxidation reaction to go