国际整流器公司两款创新的功率半导体封装设计,Super-220及Super-D2Pak,具备业界标准的封装面积和引线间距(lead spacing),却可容纳体积更大的半导体芯片,承受更高的电流。 Super-220封装与TO-220封装具有相同的面积,但硅含量却高出两倍多(相当于业界标准的TO-247封 International Rectifier’s two innovative power semiconductor package designs, the Super-220 and Super-D2Pak, feature industry-standard package size and lead spacing but accommodate larger semiconductor chips for higher current. The Super-220 package has the same area as the TO-220 package, but more than double the silicon content (equivalent to the industry standard TO-247 package