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在金属化布线电徙动试验中，采用金属薄膜电阻测温法精确测量了样品的局部温度，在环境温度为150℃，电流密度为3×106A／cm2和5×106A／cm2时，金属薄膜温度分别高于环境温度32．5℃和100℃；提出了扩散电阻测温法，在电徙动试验中精确测量并适时监控样品局部温度，从而实现了电流密度指数因子动态测试．
In the metal wiring migration test, the local temperature of the sample was accurately measured by the metal film resistance temperature measurement. When the ambient temperature was 150 ℃ and the current density was 3 × 106A / cm2 and 5 × 106A / cm2, the metal thin film The temperature is higher than the ambient temperature of 32.5 ℃ and 100 ℃ respectively. A diffusion resistance temperature measurement method is proposed, which can accurately measure and monitor the local temperature of the sample in the electromigration test, so as to realize the dynamic test of the current density index factor.