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在计算机主机逻辑中,运用高速LSI 的要求得到了广泛的承认。采用目前的硅制造工艺,主要问题是如何获得足够高的集成度与低功耗。在短的生产周期内,制造大量的单一类型的部件也是困难的。本文叙述一种适合于计算机主机逻辑的200个ECL 门电路的母片方式LSI。LSI 的特性列入表1。作成最大的集成度是减少整个系统延迟的有效手段。然而功耗一定要最小,使之容许强迫风冷而不需要特殊散热。因为各种ECL 元件如象记忆用的寄存器,复杂的中规模集成以及线驱动器/线接收器,都将要组合在一起,此外信号电平的兼容性也是一个重要因素。
In the computer host logic, the use of high-speed LSI requirements have been widely recognized. With the current silicon manufacturing process, the main issue is how to achieve sufficiently high levels of integration and low power consumption. In a short production cycle, it is also difficult to manufacture a large number of single-type parts. This article describes a master-mode LSI suitable for host computer logic of 200 ECL gates. The characteristics of LSI are listed in Table 1. Making the greatest degree of integration is an effective way to reduce overall system latency. However, the power consumption must be minimal, allowing for forced air cooling without the need for special cooling. Because various ECL components such as registers for memory, complex mid-scale integration, and line driver / line receivers are combined, signal level compatibility is also an important factor.