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通过HCl-Cu Cl2-Na Cl O湿法浸出体系对手机元器件中金属钯(Pd)、金(Au)进行浸出实验,研究不同因素对于Pd、Au浸出率的影响.结果显示,在2mol/L HCl、体积分数5%Na Cl O、0.075mol/L Cu Cl_2、固液比1%,反应温度60℃条件下,2h后Pd、Au浸出率均可达85%;结果表明,Cu~(2+)、Cl-、温度对于Pd的浸出率起很大作用,Na Cl O的加入可加快Pd浸出反应达到平衡速率;Na Cl O、温度对于Au的浸出率起关键作用,HCl、Cu~(2+)的加入可促进Au的浸出.因此,HCl-Cu Cl_2-Na Cl O湿法浸出体系对于Pd、Au具有良好的浸出效果.
The effects of different factors on the leaching rate of Pd and Au were studied by using HCl-Cu Cl2-Na Cl O wet leaching system to extract Pd and Au from mobile phone components. L, HCl, 5% Na Cl O, 0.075 mol / L Cu Cl_2, solid-liquid ratio of 1% and reaction temperature of 60 ℃ for 2 h. The results showed that the Cu ~ ( 2 +), Cl-, temperature plays a significant role in the leaching rate of Pd. The addition of NaClO can accelerate the Pd leaching reaction to reach the equilibrium rate. NaClO, temperature plays a key role in the leaching rate of Au, (2+) can promote the leaching of Au, so the wet leaching system of HCl-Cu Cl 2-Na Cl O has good leaching effect on Pd and Au.