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激光在加工微米级小孔径领域中有着明显优势,尤其是在对于特殊孔形的小孔加工中,激光可以实现高精度高速度的轮廓描绘。探讨了双光楔旋转打孔激光加工系统在不锈钢、单晶硅等材料上异形孔加工成型的工艺参数,结果表明更多的重复次数在小孔加工中起着比激光能量更重要的作用。同时实验也利用旋转双光楔扫描器在不同材料表面进行了异形微孔加工,验证了双光楔系统在实际工业打孔加工应用中的可能性。
The laser has obvious advantages in the field of processing micrometer-sized small aperture, especially in the special hole-shaped small hole machining, the laser can realize high-precision and high-speed contouring. The technological parameters of the forming and processing of profiled holes on stainless steel, monocrystalline silicon and other materials are discussed. The results show that more repetitions plays a more important role than the laser energy in the processing of small holes. In the meantime, experiments were also made on the surface of different materials by using double-wobble rotary scanner. The experiment proved the possibility of dual optical wedge system in practical industrial drilling.