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日立制作所最近开发了热膨胀系数像金属和陶瓷一样小,但能耐500℃以上温度且强度是一般型料数倍的新型“低热膨胀性能聚酰亚胺”。由于这种材料的开发,使塑料同金属和陶瓷一体化时所出现的翘曲和剥离问题得以解决。可以期待,该材料在电子工业等领域内将得到广泛的应用。该公司开发的低热膨胀性能聚酰亚胺包括应用已申请了23项专利。产品的特性如下:1)热膨胀系数能达到石英玻璃那样小,能与金属、陶瓷一体化使用;2)热膨胀系数为
Hitachi has recently developed a new type of “low thermal expansion polyimide” whose thermal expansion coefficient is as small as metal and ceramic but capable of being able to withstand temperatures above 500 ° C and strength of several times that of conventional materials. Due to the development of this material, the problem of warping and peeling that occurs when plastics are integrated with metals and ceramics is solved. It is expected that the material will be widely used in the electronics industry and other fields. The company has developed a low thermal expansion properties of polyimide including the application has applied for 23 patents. The characteristics of the product are as follows: 1) Coefficient of thermal expansion can be as small as quartz glass, can be integrated with metal and ceramic; 2) The thermal expansion coefficient is