Soitec董事长兼首席执行官近日透露,苹果iPhone 6s已经在SOI(绝缘体上硅)的基质甚至是长时间带阻滤波器的SOI上使用多个射频(RF)芯片。与此同时,Intel和IBM正使用SOI工艺推动硅光子发展。虽然SOI工艺成功之路历经坎坷,但目前已步入向主要市场渗透的正轨。格罗方德高级副总裁兼总经理Rutger Wijburg甚至声称FD-SOI(全耗尽绝缘硅)在四年内的销售量将超过FinFETs。 Soitec chairman and chief executive revealed recently that the Apple iPhone 6s has used multiple radio frequency (RF) chips on SOI (SOI) substrates and even SOIs with long-term rejection filters. At the same time, Intel and IBM are using SOI process to promote the development of silicon photonics. Although the road to success of the SOI process has been bumpy, but has now entered the main market infiltration on the right track. Rutger Wijburg, senior vice president and general manager at Groupe, even claims that FD-SOI (fully depleted silicon) will outsell FinFETs in four years.