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以法规及风险评价模型为基础,对电子封装行业内通常使用的化学有害因素进行职业暴露分析,将健康风险进行分级、定量评价,得出结论:行业中回流焊工艺可能产生的铅烟、电镀车间存在的硝酸、失效分析中使用的氢氟酸等,其职业暴露风险为中等风险水平;但由于化学物质的健康危害等级HR因其固有性而相对不变,而其会随控制措施的效果高低而变化的暴露等级ER是一个可变的要素,不同企业的控制措施的水平高低不同,其最终的风险等级可能是不同的。行业中使用的氢氧化钾、氢氧化钠的职业暴露风险为低风险水平,前提也是在合理有效的控制措施环境下。因此,控制措施的水平就是决定风险等级的最重要因素。时时地运行和维护有效的控制措施,是确保风险水平不发生变化的关键。
Based on laws and regulations and risk assessment model, occupational exposure analysis of commonly used chemical hazards in the electronic packaging industry was conducted to classify and quantitatively evaluate the health risks. The conclusion was drawn that lead smoke, electroplating The presence of nitric acid in the workshop, hydrofluoric acid used in failure analysis and so on, the occupational exposure risk is medium risk level. However, because the health hazard level of chemical substances HR is relatively unchanged due to its inherentity, its effect will be controlled by the control measures The level of exposure to change ER is a variable element, the level of control of different enterprises vary, the final level of risk may be different. Occupational exposure to potassium hydroxide and sodium hydroxide used in the industry is at a low risk level, provided that it is also under a reasonable and effective control environment. Therefore, the level of control measures is the most important factor in determining the level of risk. Timely operation and maintenance of effective controls is the key to ensuring that the level of risk does not change.