简介利用最先进的材料设计低成本的高度可靠的微波电子、微电子、光电子和功率半导体系统是不现实的。为了保证此类设备的可靠性,需要电子封装和衬底热管理解决方案,因此工程师需要既能够提供热管理特性,同时又能够在更小型的设计中达到最优功率密度的材料。要低成本生产此类材 Introduction Designing low-cost, highly reliable microwave electronics, microelectronics, optoelectronics and power semiconductor systems using state-of-the-art materials is impractical. To ensure the reliability of such devices requires electronic package and substrate thermal management solutions, engineers need materials that offer both thermal management features and optimal power density in a smaller design. To produce such materials at low cost