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金邦“金条”在推出后,产品效能受到使用者的肯定与激赏。原因何在?“金条”是由金邦科技专业设计制造的记忆体模组,采用了顶级日系原厂晶片加上是先进的“BLP”封装技术,在经过专业测试仪器的检定后也证实其电气特性比一般 TSOP 四层板产品来得更加稳定。金邦科技贴心地为您设计了 SPD 值不同的三种金条模组供大家
Gem “bullion” in the launch, the product performance by the user’s recognition and appreciation. What is the reason? “Gold bars” is a memory module designed and manufactured by GeBang Technology. It uses the top Japanese original chip plus advanced “BLP” packaging technology, and also confirms its electrical performance after being tested by a professional testing instrument Features than the average TSOP four-board products come more stable. Geely technology intimate for you to design a different SPD value of the three gold bars for everyone