前言从经典金相技术的出现开始,化学浸蚀即被用于金相试样的制备过程。化学溶解(抛光)和电解抛光产生在本世纪初期,开始时只零星地应用在铜、银、金等金属和合金的个别生产中,以获得光亮的表面。1935年P.A.Jacquet[1]第一次用电解抛光代替传统的机械抛光制备金相试样。从这以后,由于电解抛光速度快、质量好、易于控制和抛光表面具有许多物理、化学方面的优越性而得到了较快的发展。现在已成为近代实验 Preface From the advent of classical metallurgical techniques, chemical etching was used to prepare metallographic specimens. Chemical dissolution (polishing) and electropolishing originated in the early 2000s and was initially used sporadically in individual production of metals such as copper, silver, gold, and the like, to obtain bright surfaces. In 1935 P.A.Jacquet [1] for the first time with electrolytic polishing instead of the traditional mechanical polishing preparation metallographic sample. Since then, there has been a rapid development due to the many physical and chemical advantages of electrolytic polishing, good quality, easy control and polishing of the surface. It has now become a modern experiment