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A novel COB(chip-on-board) structure with integrated multifunction is presented.The structure is prepared by laminating copper plate with FR4 board and then coating with a silver layer to offer high reflectivity and high conductivity.In comparison with MCPCB(aluminum) and ceramics(Al_2O_3) board,the substrate brings about 10%higher light extracting efficiency than aluminum board and 5%higher flux maintenance ratio than ceramics(Al_2O_3) board at 3000 h.With integrated multifunction,through an IC component driving high voltage serial LED chips,the COB can be directly connected to AC 110 V or 220 V power supply in lighting application.
A novel COB (chip-on-board) structure with integrated multifunction is presented. The structure is prepared by laminating copper plate with FR4 board and then coating with a silver layer to offer high reflectivity and high conductivity. In comparison with MCPCB (aluminum) and ceramic (Al_2O_3) board at about 10% higher light extraction efficiency than aluminum board and 5% higher flux maintenance ratio than ceramics (Al_2O_3) board at 3000 h.With integrated multifunction, through an IC component driving high voltage serial LED chips, the COB can be directly connected to AC 110 V or 220 V power supply in lighting application.