We optimize the room-temperature etching of InP using Cl2/CH4/H2 and Cl2/N2 inductively coupled plasma reactive ions. A design of experiment is used in the optimization. The results, in terms of etch rate, surface roughness and etched profile, are presented. These Cl2-based recipes do not require substrate heating and thus can be more cost effectively and widely applied. The Cl2/CH4/H2 process is able to give a higher etch rate (about 850nm/min) and cleaner surface with less polymer formation compared to the conventional CH4/H2 process.