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微电路的热扩散是一个很复杂的过程。内热阻的计算基本上有三种方法:一维导热法、解析法和45°扩散法。45°扩散法认为热流是以45°的扩散角从热源向导热体扩散开来的。因计算结果和实测值颇为接近,所以常为人们采用。本文结合具体厚膜组件,详细地介绍了热阻的计算公式、平均热流通路概念,以及热流通路互相覆盖时热阻的计算和梁引线的热分析。
Thermal diffusion of microcircuits is a complex process. There are basically three ways to calculate the internal thermal resistance: one-dimensional thermal analysis, analytical method and 45 ° diffusion method. The 45 ° diffusion method holds that the heat flow spreads from the heat source to the thermal conductor at a diffusion angle of 45 °. Due to the calculated results and the measured values are quite close, so often used by people. In this paper, the calculation formula of thermal resistance, the concept of average heat flow path, the calculation of thermal resistance and the thermal analysis of beam lead are introduced in detail with the concrete thick-film components.