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针对60GHz的光纤到户无线通信应用,我们设计了一种基于磷化铟的远端接入点集成光子芯片~[1]。在多项目晶圆的框架下,为了确保芯片能满足截止日期的要求,我们选取了两个不同的晶圆厂流片。在设计过程中,我们仔细检验了设计方法,从需要满足的功能、结构单元的参数,直到准备最后的掩膜设计。针对于不同晶圆厂的,最后的掩膜设计是不同的。但通过在设计环境下使用通用的结构单元(Building Blocks,BBs),使针对不同晶圆厂之间的设计转换变得容易,从而大大降低了芯片设计所需要的时间。
For the 60GHz fiber-to-the-home wireless communication application, we designed a remote access point integrated photonic chip based on indium phosphide [1]. In the framework of multi-project wafer, in order to ensure that the chip can meet the deadline requirements, we selected two different wafer fab slices. In the design process, we carefully examined the design method, from the need to meet the function, the parameters of the structural unit, until the preparation of the final mask design. For different fabs, the final mask design is different. However, by using common building blocks (BBs) in a design environment, design translations across different fabs can be made easier, dramatically reducing the time required for the chip design.