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采用溶胶-凝胶法制备了铜铁矿结构CuxAlO2陶瓷体材.当1≤x<1.04时,样品为纯铜铁矿相,当x≥1.04时,样品中出现了微弱的CuO相.样品Cu1.04AlO2的室温电导率比名义组分CuAlO2大了近一个数量级.研究表明,替位式缺陷CuAl(Cu2+离子取代Al3+离子)是导致电导增加的主要受主缺陷机制,Cu过量CuxAlO2的分子式可更准确地表示为Cu(Al1-yCuy)O2.
The Cu-Fe-Cu-CuxAlO2 ceramic material was prepared by sol-gel method. When 1≤x <1.04, the sample was pure Fe-Fe phase. When x≥1.04, a weak CuO phase appeared in the sample. .The room temperature conductivity of Al 2 O 4 is almost one order of magnitude larger than that of the nominal CuAl 2. The results show that CuAl (Cu 2+ ion substituted Al 3+ ions) is the main acceptor defect mechanism that leads to the increase of conductance. Accurately expressed as Cu (Al1-yCuy) O2.