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研究结果表明, 在Ag - Cu - Pd 合金钎料(BAg65CuPd) 中添加0.2 ~1.0wt% Co 后,对钎料的物理性能、电学性能以及力学性能无明显影响, 但对BAg65CuPd 钎料在某些母材上过度的铺展性确有显著地抑制作用, Ag65Cu20Pd15 - xCox (0.2 ≤x ≤1.0) 钎料可以部分地取代电子器件中的金基纤料。
The results show that the addition of 0.2-1.0 wt% Co to Ag - Cu - Pd alloy brazing filler metal (BAg65CuPd) has no obvious effect on the physical, electrical and mechanical properties of the brazing filler metal. However, Excessive spreading on some base metals does have a significant inhibitory effect. Ag65Cu20Pd15 - xCox (0.2 ≤ x ≤1.0) solders can partially replace gold-based fibers in electronic devices.